10.1″ Android/Linux Smart HMI Display for Embedded Applications
The ND101SHG1024600-A01 is a 10.1-inch Android/Linux smart HMI display designed for embedded control, smart equipment, industrial interfaces, and interactive display applications. It combines a 1024×600 IPS TFT display, capacitive touchscreen, Allwinner A133P quad-core processor, 1 GB RAM, 8 GB storage, and multiple communication interfaces in a compact open-frame module.
Specifications
| Model | ND101SHG1024600-A01 |
|---|---|
| Display | 10.1″ IPS TFT, 1024×600 |
| Brightness | 500 cd/m² |
| Touch | Capacitive Touchscreen |
| Operating System | Android / Linux |
| Processor | Allwinner A133P, Quad-Core Cortex-A53, up to 1.8 GHz |
| Memory | 1 GB RAM + 8 GB Flash Storage |
| Wired Interfaces | USB-C, USB 2.0, RS-232, RS-485, CAN, GPIO, Ethernet |
| Wireless Connectivity | Wi-Fi and Bluetooth; 4G optional |
| Audio | Amplifier Output, Audio Output, Microphone Input |
| Power Input | 5 V DC |
| Power Consumption | <3 W |
| Overall Dimensions | 258.3 × 148 × 24.3 mm |
| Active Area | 222.72 × 125.28 mm |
| Mounting | Open-Frame / Embedded Mount |
| Operating Temperature | −30°C to +70°C |
| Preloaded Software | Optional system utilities and demonstration applications are available based on the selected Android/Linux configuration. |
Display Drawing
Customization Options
Hardware Customization
Optional customization includes display brightness, touch solution, memory and storage, PCBA design, power input, audio functions, and mechanical structure.
Interface & Connectivity Customization
Available customization may include RS-232, RS-485, CAN, GPIO, USB, Ethernet, Wi-Fi, Bluetooth, and 4G connectivity based on project requirements.
Software & UI Customization
Optional services include Android/Linux system configuration, boot logo customization, application pre-installation, UI development, multilingual support, and communication protocol integration.
Industrial-Grade Customization
Optional enhancements may include extended-temperature components, optical bonding, EMC improvements, customized enclosures, and upgraded environmental protection. Final specifications are subject to engineering evaluation.
